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HKUST 2012-13 Annual Report
59
Faculty
• Six faculty members from the Department of Electronic
and Computer Engineering were made Fellows of the
Hong Kong Institution of Engineers. They are Prof Khaled
Ben Letaief, Dean of Engineering, Prof Roger Cheng,
Prof Ross Murch, Prof Oscar Au, Prof Vincent Lau and
Prof Danny Tsang.
• Prof Ross Murch, Department of Electronic and Computer
Engineering, was made a Fellow of the Institution of
Engineering and Technology.
• Prof Oscar Au, Department of Electronic and Computer
Engineering, was elected Chair of the Asia-Pacific Signal
and Information Processing Association (APSIPA) Image,
Video and Multimedia Technical Committee.
• Prof Shiu Yuen Cheng,
Department of Mathematics,
was elected a Fellow of the
American Mathematical
Society.
• Prof Hong K Lo, Department of Civil
and Environmental Engineering, was
elected Convener of the International
Scientific Committee of the triennial
Conference on Advanced Systems for
Public Transport.
• Prof Jianan Qu, Department
of Electronic and Computer
Engineering, became a Fellow of
the Optical Society of America.
• Prof Gary Shiu, Department
of Physics, was elected a
Fellow of the Institute for
Physics, UK, and awarded
the Johannes Diderik van
der Waals Chair by the
University of Amsterdam.
• Prof Qiang Yang, Department
of Computer Science and
Engineering, was made a Fellow
of the International Association
for Pattern Recognition, American
Association for the Advancement
of Science, and Association for
the Advancement of Artificial
Intelligence.
Papers
• Prof Jack Cheng and PhD student
Ms Moumita Das, Department of
Civil and Environmental Engineering,
received the Best Applied Paper
Award at the 14th International
Conference on Computing in Civil and
Building Engineering (ICCCBE-XIV).
• Prof Francesco Ciucci,
Department of Mechanical
Engineering, received the Journal
of Laboratory Automation Ten
Award (JALA Ten 2013).
• Prof Ricky Lee, Department of
Mechanical Engineering, won the
Outstanding Paper Award at the
12th International Conference on
Electronics Packaging.